Power chips are linked to exterior circuits with packaging, and their performance depends on the support of the packaging. In high-power scenarios, power chips are typically packaged as power modules. Chip interconnection refers to the electrical link on the top surface of the chip, which is usually light weight aluminum bonding wire in traditional modules. ^
Standard power component plan cross-section
Currently, commercial silicon carbide power components still mostly utilize the product packaging modern technology of this wire-bonded typical silicon IGBT component. They face troubles such as huge high-frequency parasitical specifications, not enough heat dissipation capability, low-temperature resistance, and inadequate insulation stamina, which restrict using silicon carbide semiconductors. The display screen of outstanding efficiency. In order to resolve these troubles and totally manipulate the significant possible advantages of silicon carbide chips, numerous new product packaging modern technologies and remedies for silicon carbide power modules have emerged over the last few years.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold cables to copper cords, and the driving force is expense reduction; high-power tools have actually established from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance item performance. The greater the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to typical bonding packaging techniques, Cu Clip innovation has the following benefits:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific extent, changes the basic cable bonding method between the chip and the pins. For that reason, an unique bundle resistance worth, higher existing flow, and far better thermal conductivity can be gotten.
2. The lead pin welding area does not need to be silver-plated, which can completely save the expense of silver plating and inadequate silver plating.
3. The product look is completely consistent with regular products and is generally utilized in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power products, and various other fields.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both eviction pad and the Source pad are clip-based. This bonding technique is extra costly and complex, yet it can achieve much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding approach
The source pad uses a Clip approach, and the Gate utilizes a Wire approach. This bonding method is somewhat less costly than the all-copper bonding method, conserving wafer area (suitable to really little entrance locations). The process is less complex than the all-copper bonding technique and can get better Rdson and better thermal result.
Provider of Copper Strip
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